From November 17th to 19th, 2025, the Inaugural Conference of the Semiconductor Equipment Branch was successfully held in Lin'an, Hangzhou. Hosted by the CMES and co-organized by the College of Mechanical Engineering at Zhejiang University, the conference gathered over 350 experts and scholars from 51 universities, 7 research institutes, 49 key enterprises, and 10 industry organizations across China.
1. Official Establishment of the Branch
The conference officially announced the establishment of the Semiconductor Equipment Branch and appointed its first committee. Academician Lin Zhongqin presented appointment letters to Professor Fu Xin, the newly elected Chair, and the Vice-Chairs. Professor Fu pledged to work diligently to ensure the branch's success. The meeting also announced the formation of the Semiconductor Standards Working Group and released a list of five initial团体 standards, marking a solid step forward in industry standardization.
2. Cutting-Edge Academic Reports
Seven renowned experts, including Academician Chen Xuedong and Chairman Lei Zhenlin, delivered keynote speeches. Topics covered frontier fields such as IC manufacturing equipment dynamics, the status of the IC component industry, high-precision manufacturing of electronic devices, the challenges and opportunities for domestic equipment, the localization of ultra-clean fluid control components, and ultra-precision manufacturing technologies. The reports provided in-depth analysis of industry pain points and future directions.
3. Diverse Exchange Activities
The conference featured four specialized sub-forums on Manufacturing, Metrology, Packaging & Testing, and Components & Materials. Twenty-four committee members delivered presentations, sparking lively discussions on technological challenges and industry-university-research collaboration. Additionally, an exhibition area showcased corporate achievements. Organized visits to local semiconductor equipment enterprises were conducted, and the First Working Meeting of the First Committee was held. These activities effectively promoted academic exchange and industry integration.
The convening of this conference has not only established a high-level platform for collaboration among industry, academia, research, and application but also rallied significant support for promoting independent innovation and high-quality development in China's semiconductor equipment technology.
