Report: Thermal Spread during Electrosurgical Coagulation in Neurosurgery
Reporter: Doctor Roland K. Chen
Time: Jun. 5, 2:00PM
Address: Room 205, No1 Teaching Building, Yuquan Campus, Zhejiang University
Abstract:
This study investigates the thermal spread during electrosurgical coagulation and develops a tissue-mimicking phantom material for electrosurgical simulator. Bipolar coagulation is an important procedure to control bleeding in neurosurgery. However, the thermal damage caused by electrosurgical coagulation can lead to postoperative issues and is detrimental to a patient's long-term recovery. This study aims to quantify the thermal spread during coagulation experimentally and numerically, and to develop a phantom material as a training tool that allows the education of surgeons for the use of electrosurgical devices.
Bio:
Roland K. Chen (S ’12) was born in Taipei, Taiwan in 1984. He received the B.S. and M.S. degrees in mechanical engineering from National Taiwan University, Taipei, Taiwan in 2005 and 2008, respectively. He received the Ph.D. degree at the University of Michigan at Ann Arbor, MI. Currently, he is a Postdoctoral Research Fellow at the University of Michigan at Ann Arbor, MI. His research involves tissue joining, bioheat transfer, electrosurgery, and design of medical devices.
